Knowledge Management System Of Institute of Semiconductors,CAS
| Minimum thermal conductance in graphene and boron nitride superlattice | |
| Jiang JW; Wang JS; Wang BS; Jiang, JW (reprint author), Natl Univ Singapore, Dept Phys, Singapore 117542, Singaporephyjj@nus.edu.sg | |
| 2011 | |
| Source Publication | APPLIED PHYSICS LETTERS
 |
| ISSN | 0003-6951 |
| Volume | 99Issue:4Pages:43109 |
| Abstract | The minimum thermal conductance versus supercell size (d(s)) is revealed in graphene and boron nitride superlattice with d(s) far below the phonon mean free path. The minimum value is reached at a constant ratio of d(s)/L approximate to 5%, where L is the thickness of the superlattice; thus, the minimum point of d(s) depends on L. The phenomenon is attributed to the localization property and the number of confined modes in the superlattice. With the increase of d(s), the localization of the confined mode is enhanced while the number of confined modes decreases, which directly results in the minimum thermal conductance. (C) 2011 American Institute of Physics. [doi:10.1063/1.3619832] |
| metadata_83 | 半导体超晶格国家重点实验室 |
| Keyword | Conductivity Transport |
| Subject Area | 半导体物理 |
| Funding Organization | National University of Singapore[R-144-000-257-112] |
| Indexed By | SCI |
| Language | 英语 |
| Date Available | 2012-01-06 |
| Document Type | 期刊论文 |
| Identifier | http://ir.semi.ac.cn/handle/172111/22695 |
| Collection | 半导体超晶格国家重点实验室 |
| Corresponding Author | Jiang, JW (reprint author), Natl Univ Singapore, Dept Phys, Singapore 117542, Singaporephyjj@nus.edu.sg |
| Recommended Citation GB/T 7714 | Jiang JW,Wang JS,Wang BS,et al. Minimum thermal conductance in graphene and boron nitride superlattice[J]. APPLIED PHYSICS LETTERS,2011,99(4):43109. |
| APA | Jiang JW,Wang JS,Wang BS,&Jiang, JW .(2011).Minimum thermal conductance in graphene and boron nitride superlattice.APPLIED PHYSICS LETTERS,99(4),43109. |
| MLA | Jiang JW,et al."Minimum thermal conductance in graphene and boron nitride superlattice".APPLIED PHYSICS LETTERS 99.4(2011):43109. |
| Files in This Item: | ||||||
| File Name/Size | DocType | Version | Access | License | ||
| Minimum thermal cond（698KB） | 限制开放 | -- | Application Full Text | |||
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