Mechanism of Wafer Bonding Process

SEMI OpenIR > 中国科学院半导体研究所（2009年前）

	Mechanism of Wafer Bonding Process
	Han Weihua; Yu Jinzhong; Wang Qiming
	2000
Source Publication	Semiconductor Photonics and Technology
Volume	6 Issue:3 Pages:169
metadata_83	中科院半导体所
Subject Area	光电子学
Funding Organization	国家自然科学基金
Indexed By	CSCD
Language	英语
CSCD ID	CSCD:533218
Date Available	2010-11-23
Citation statistics
Document Type	期刊论文
Identifier	http://ir.semi.ac.cn/handle/172111/18601
Collection	中国科学院半导体研究所（2009年前）
Recommended Citation GB/T 7714	Han Weihua,Yu Jinzhong,Wang Qiming. Mechanism of Wafer Bonding Process[J]. Semiconductor Photonics and Technology,2000,6(3):169.
APA	Han Weihua,Yu Jinzhong,&Wang Qiming.(2000).Mechanism of Wafer Bonding Process.Semiconductor Photonics and Technology,6(3),169.
MLA	Han Weihua,et al."Mechanism of Wafer Bonding Process".Semiconductor Photonics and Technology 6.3(2000):169.

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