SEMI OpenIR  > 中国科学院半导体研究所(2009年前)
Mechanism of Wafer Bonding Process
Han Weihua; Yu Jinzhong; Wang Qiming
2000
Source PublicationSemiconductor Photonics and Technology
Volume6Issue:3Pages:169
metadata_83中科院半导体所
Subject Area光电子学
Funding Organization国家自然科学基金
Indexed ByCSCD
Language英语
CSCD IDCSCD:533218
Date Available2010-11-23
Citation statistics
Document Type期刊论文
Identifierhttp://ir.semi.ac.cn/handle/172111/18601
Collection中国科学院半导体研究所(2009年前)
Recommended Citation
GB/T 7714
Han Weihua,Yu Jinzhong,Wang Qiming. Mechanism of Wafer Bonding Process[J]. Semiconductor Photonics and Technology,2000,6(3):169.
APA Han Weihua,Yu Jinzhong,&Wang Qiming.(2000).Mechanism of Wafer Bonding Process.Semiconductor Photonics and Technology,6(3),169.
MLA Han Weihua,et al."Mechanism of Wafer Bonding Process".Semiconductor Photonics and Technology 6.3(2000):169.
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