A fair use statement regarding the full text of the request

Your requested [倒V型二氧化硅沟槽结构生长硅基砷化镓材料的方法] is currently limited to Institute of Semiconductors,Chinese Academy of Sciences internal sharing.

To solicit author authorization, you need to provide the following information: name, organization, personal e-mail, reason for request. The information you provide will be reviewed and you are committed to the truth of the information provided. The personal information you provide will be protected according to law.


You agree and are willing to abide by the above requirements.